Inventor
HO LUNG-HUA
TW16 patents
⚠️ This page may combine multiple inventors who share the name “HO LUNG-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
10 patentsUS12424551B2Sep 23, 2025
Semiconductor structure and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations61
US11651974B2May 16, 2023
Semiconductor package and method of fabricating the same
CHIPBOND TECHNOLOGY CORP1 citations61
US8658528B2Feb 25, 2014
Bumping process and structure thereof
CHIPBOND TECHNOLOGY CORP3 citations60
US12224183B2Feb 11, 2025
Method of manufacturing semiconductor device
CHIPBOND TECHNOLOGY CORP0 citations58
US12543581B2Feb 3, 2026
Flip-chip bonding structure and substrate thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US9159660B2Oct 13, 2015
Semiconductor package structure and method for making the same
CHIPBOND TECHNOLOGY CORP0 citations48
US9059260B2Jun 16, 2015
Semiconductor manufacturing method and semiconductor structure thereof
CHIPBOND TECHNOLOGY CORP0 citations48
US8823169B2Sep 2, 2014
Semiconductor manufacturing method and semiconductor structure thereof
CHIPBOND TECHNOLOGY CORP1 citations48
US12538805B2Jan 27, 2026
Semiconductor package and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations46
US8772644B2Jul 8, 2014
Carrier with three-dimensional capacitor
CHIPBOND TECHNOLOGY CORP0 citations40