Inventor

MI HSUAN-HAO

TW2 patents

Patents

2 patents

US11205644B2Dec 21, 2021

Method for fabricating electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58

US10629572B2Apr 21, 2020

Electronic package and method for fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47