Inventor
KONARSKI MARK M
US22 patents
⚠️ This page may combine multiple inventors who share the name “KONARSKI MARK M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HENKEL CORP
9 patentsUS7109061B2Sep 19, 2006
Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
HENKEL CORP51 citations89
US7547735B1Jun 16, 2009
UV curable compositions
HENKEL CORP13 citations83
US7087304B1Aug 8, 2006
Polysulfide-based toughening agents, compositions containing same and methods for the use thereof
HENKEL CORP11 citations83
US7915319B2Mar 29, 2011
Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions
HENKEL CORP11 citations79
US6893736B2May 17, 2005
Thermosetting resin compositions useful as underfill sealants
HENKEL CORP8 citations74
US6818318B2Nov 16, 2004
Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex
HENKEL CORP7 citations74
US7009009B1Mar 7, 2006
Fluxing underfill compositions
HENKEL CORP10 citations72
US6951907B1Oct 4, 2005
Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex
HENKEL CORP5 citations63
US7193016B1Mar 20, 2007
Epoxy-extended polyacrylate toughening agent
HENKEL CORP4 citations58
HENKEL LOCTITE CORP
6 patentsUS6632893B2Oct 14, 2003
Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
HENKEL LOCTITE CORP98 citations94
US6458472B1Oct 1, 2002
Fluxing underfill compositions
HENKEL LOCTITE CORP53 citations94
US6667194B1Dec 23, 2003
Method of bonding die chip with underfill fluxing composition
HENKEL LOCTITE CORP33 citations91
US6706417B2Mar 16, 2004
Fluxing underfill compositions
HENKEL LOCTITE CORP17 citations86
US6617399B2Sep 9, 2003
Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
HENKEL LOCTITE CORP15 citations84
US6670430B1Dec 30, 2003
Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes
HENKEL LOCTITE CORP12 citations74
LOCTITE CORP
3 patentsUS6391993B1May 21, 2002
High temperature, controlled strength anaerobic compositions curable under ambient environmental conditions
LOCTITE CORP36 citations90
US6342577B1Jan 29, 2002
Thermosetting resin compositions useful as underfill sealants
LOCTITE CORP22 citations89
US6519968B1Feb 18, 2003
Shipping container for exothermic material
LOCTITE CORP18 citations84