Inventor
MANGAOANG TITO
PH4 patents
Patents
4 patentsUS9972558B1May 15, 2018
Leadframe package with side solder ball contact and method of manufacturing
ST MICROELECTRONICS INC23 citations91
US11658098B2May 23, 2023
Leadframe package with side solder ball contact and method of manufacturing
ST MICROELECTRONICS INC0 citations59
US10840168B2Nov 17, 2020
Leadframe package with side solder ball contact and method of manufacturing
ST MICROELECTRONICS INC0 citations49
US10141246B2Nov 27, 2018
Leadframe package with side solder ball contact and method of manufacturing
ST MICROELECTRONICS INC0 citations49