Inventor
SENDA TAKESHI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “SENDA TAKESHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SENDA TAKESHI
4 patentsUS9059099B2Jun 16, 2015
Thermal treatment method of silicon wafer and silicon wafer
SENDA TAKESHI0 citations48
US8999864B2Apr 7, 2015
Silicon wafer and method for heat-treating silicon wafer
SENDA TAKESHI0 citations48
US8252700B2Aug 28, 2012
Method of heat treating silicon wafer
SENDA TAKESHI0 citations48
US8399341B2Mar 19, 2013
Method for heat treating a silicon wafer
SENDA TAKESHI0 citations37
TOSHIBA CERAMICS CO
3 patentsUS7250357B2Jul 31, 2007
Manufacturing method for strained silicon wafer
TOSHIBA CERAMICS CO10 citations82
US7247583B2Jul 24, 2007
Manufacturing method for strained silicon wafer
TOSHIBA CERAMICS CO3 citations60
US7060597B2Jun 13, 2006
Manufacturing method for a silicon substrate having strained layer
TOSHIBA CERAMICS CO5 citations60
GLOBALWAFERS JAPAN CO LTD
3 patentsUS12046469B2Jul 23, 2024
Manufacturing method for semiconductor silicon wafer
GLOBALWAFERS JAPAN CO LTD2 citations68
US10141180B2Nov 27, 2018
Silicon wafer and method for manufacturing the same
GLOBALWAFERS JAPAN CO LTD1 citations49
US12308228B2May 20, 2025
Manufacturing method for semiconductor silicon wafer
GLOBALWAFERS JAPAN CO LTD0 citations47