Inventor
HOW YOU CHYE
MY20 patents
⚠️ This page may combine multiple inventors who share the name “HOW YOU CHYE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
11 patentsUS9620388B2Apr 11, 2017
Integrated circuit package fabrication with die attach paddle having middle channels
TEXAS INSTRUMENTS INC3 citations64
US11830791B2Nov 28, 2023
Leads for leadframe and semiconductor package
TEXAS INSTRUMENTS INC0 citations62
US12525500B2Jan 13, 2026
Coated semiconductor dies
TEXAS INSTRUMENTS INC0 citations60
US11837518B2Dec 5, 2023
Coated semiconductor dies
TEXAS INSTRUMENTS INC0 citations60
US9123626B1Sep 1, 2015
Integrated passive flip chip package
TEXAS INSTRUMENTS INC2 citations56
US9202778B2Dec 1, 2015
Integrated circuit package with die attach paddle having at least one recessed portion
TEXAS INSTRUMENTS INC3 citations54
US11328984B2May 10, 2022
Multi-die integrated circuit packages and methods of manufacturing the same
TEXAS INSTRUMENTS INC1 citations52
US10804114B2Oct 13, 2020
Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides
TEXAS INSTRUMENTS INC0 citations51
US10079162B1Sep 18, 2018
Method for making lead frames for integrated circuit packages
TEXAS INSTRUMENTS INC0 citations51
US9978613B1May 22, 2018
Method for making lead frames for integrated circuit packages
TEXAS INSTRUMENTS INC0 citations51
US10381293B2Aug 13, 2019
Integrated circuit package having an IC die between top and bottom leadframes
TEXAS INSTRUMENTS INC0 citations50
NAT SEMICONDUCTOR CORP
8 patentsUS8048781B2Nov 1, 2011
Methods and systems for packaging integrated circuits
NAT SEMICONDUCTOR CORP22 citations92
US7749809B2Jul 6, 2010
Methods and systems for packaging integrated circuits
NAT SEMICONDUCTOR CORP37 citations91
US8030138B1Oct 4, 2011
Methods and systems of packaging integrated circuits
NAT SEMICONDUCTOR CORP14 citations82
US7582954B1Sep 1, 2009
Optical leadless leadframe package
NAT SEMICONDUCTOR CORP11 citations82
US6972244B1Dec 6, 2005
Marking semiconductor devices through a mount tape
NAT SEMICONDUCTOR CORP12 citations79
US7863757B2Jan 4, 2011
Methods and systems for packaging integrated circuits
NAT SEMICONDUCTOR CORP6 citations72
US8018050B2Sep 13, 2011
Integrated circuit package with integrated heat sink
NAT SEMICONDUCTOR CORP5 citations61
US7868433B2Jan 11, 2011
Low stress cavity package
NAT SEMICONDUCTOR CORP0 citations40