Inventor
YEONG SHEE MIN
MY7 patents
Patents
7 patentsUS7749809B2Jul 6, 2010
Methods and systems for packaging integrated circuits
NAT SEMICONDUCTOR CORP37 citations91
US8030138B1Oct 4, 2011
Methods and systems of packaging integrated circuits
NAT SEMICONDUCTOR CORP14 citations82
US7582954B1Sep 1, 2009
Optical leadless leadframe package
NAT SEMICONDUCTOR CORP11 citations82
US7998791B2Aug 16, 2011
Panel level methods and systems for packaging integrated circuits with integrated heat sinks
NAT SEMICONDUCTOR CORP15 citations76
US7863757B2Jan 4, 2011
Methods and systems for packaging integrated circuits
NAT SEMICONDUCTOR CORP6 citations72
US8018050B2Sep 13, 2011
Integrated circuit package with integrated heat sink
NAT SEMICONDUCTOR CORP5 citations61
US7868433B2Jan 11, 2011
Low stress cavity package
NAT SEMICONDUCTOR CORP0 citations40