Inventor

KUMAMOTO SEISHI

JP4 patents

⚠️ This page may combine multiple inventors who share the name “KUMAMOTO SEISHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FURUKAWA ELECTRIC CO LTD

2 patents

US5453582ASep 26, 1995

Circuit board to be precoated with solder layers and solder circuit board

FURUKAWA ELECTRIC CO LTD70 citations92

US5601228AFeb 11, 1997

Solder-precipitating composition and mounting method using the composition

FURUKAWA ELECTRIC CO LTD14 citations70

HARIMA CHEMICALS INC

2 patents

US7452797B2Nov 18, 2008

Solder deposition method and solder bump forming method

HARIMA CHEMICALS INC24 citations88

US7503958B2Mar 17, 2009

Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder

HARIMA CHEMICALS INC4 citations55