Inventor
ADEM ERCAN
US15 patents
⚠️ This page may combine multiple inventors who share the name “ADEM ERCAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
13 patentsUS6562718B1May 13, 2003
Process for forming fully silicided gates
ADVANCED MICRO DEVICES INC107 citations98
US6281559B1Aug 28, 2001
Gate stack structure for variable threshold voltage
ADVANCED MICRO DEVICES INC107 citations98
US7115498B1Oct 3, 2006
Method of ultra-low energy ion implantation to form alloy layers in copper
ADVANCED MICRO DEVICES INC22 citations92
US6869878B1Mar 22, 2005
Method of forming a selective barrier layer using a sacrificial layer
ADVANCED MICRO DEVICES INC20 citations92
US6667070B1Dec 23, 2003
Method of in situ monitoring of thickness and composition of deposited films using raman spectroscopy
ADVANCED MICRO DEVICES INC31 citations92
US6583070B1Jun 24, 2003
Semiconductor device having a low dielectric constant material
ADVANCED MICRO DEVICES INC17 citations92
US6521529B1Feb 18, 2003
HDP treatment for reduced nickel silicide bridging
ADVANCED MICRO DEVICES INC27 citations92
US6383925B1May 7, 2002
Method of improving adhesion of capping layers to cooper interconnects
ADVANCED MICRO DEVICES INC35 citations92
US6208030B1Mar 27, 2001
Semiconductor device having a low dielectric constant material
ADVANCED MICRO DEVICES INC31 citations92
US6605513B2Aug 12, 2003
Method of forming nickel silicide using a one-step rapid thermal anneal process and backend processing
ADVANCED MICRO DEVICES INC16 citations83
US6641747B1Nov 4, 2003
Method and apparatus for determining an etch endpoint
ADVANCED MICRO DEVICES INC9 citations74
US6770559B1Aug 3, 2004
Method of forming wiring by implantation of seed layer material
ADVANCED MICRO DEVICES INC12 citations73
US6518185B1Feb 11, 2003
Integration scheme for non-feature-size dependent cu-alloy introduction
ADVANCED MICRO DEVICES INC5 citations62