Inventor
CHEN XIANGDONG
US167 patents
⚠️ This page may combine multiple inventors who share the name “CHEN XIANGDONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS7368358B2May 6, 2008
Method for producing field effect device that includes epitaxially growing SiGe source/drain regions laterally from a silicon body
IBM62 citations98
US7057216B2Jun 6, 2006
High mobility heterojunction complementary field effect transistors and methods thereof
IBM151 citations98
US6972461B1Dec 6, 2005
Channel MOSFET with strained silicon channel on strained SiGe
IBM97 citations98
US7002209B2Feb 21, 2006
MOSFET structure with high mechanical stress in the channel
IBM61 citations96
US7635620B2Dec 22, 2009
Semiconductor device structure having enhanced performance FET device
IBM16 citations93
US7361539B2Apr 22, 2008
Dual stress liner
IBM19 citations93
US7294879B2Nov 13, 2007
Vertical MOSFET with dual work function materials
IBM21 citations93
US7045873B2May 16, 2006
Dynamic threshold voltage MOSFET on SOI
IBM47 citations93
US7867839B2Jan 11, 2011
Method to reduce threshold voltage (Vt) in silicon germanium (SiGe), high-k dielectric-metal gate, p-type metal oxide semiconductor field effect transistors
IBM21 citations92
US8372721B2Feb 12, 2013
Work function engineering for eDRAM MOSFETs
IBM6 citations84
US7960223B2Jun 14, 2011
Structure and method to integrate dual silicide with dual stress liner to improve CMOS performance
IBM9 citations84
US7947557B2May 24, 2011
Heterojunction tunneling field effect transistors, and methods for fabricating the same
IBM7 citations84
US7479689B2Jan 20, 2009
Electronically programmable fuse having anode and link surrounded by low dielectric constant material
IBM8 citations84
US7442585B2Oct 28, 2008
MOSFET with laterally graded channel region and method for manufacturing same
IBM9 citations84
US7432553B2Oct 7, 2008
Structure and method to optimize strain in CMOSFETs
IBM13 citations84
US7102914B2Sep 5, 2006
Gate controlled floating well vertical MOSFET
IBM18 citations84
US7388267B1Jun 17, 2008
Selective stress engineering for SRAM stability improvement
IBM16 citations82
US7471548B2Dec 30, 2008
Structure of static random access memory with stress engineering for stability
IBM13 citations81
CHEN XIANGDONG
10 patentsUS8129797B2Mar 6, 2012
Work function engineering for eDRAM MOSFETs
CHEN XIANGDONG120 citations99
US8299545B2Oct 30, 2012
Method and structure to improve body effect and junction capacitance
CHEN XIANGDONG30 citations93
US9040960B2May 26, 2015
Heterojunction tunneling field effect transistors, and methods for fabricating the same
CHEN XIANGDONG9 citations84
US8441000B2May 14, 2013
Heterojunction tunneling field effect transistors, and methods for fabricating the same
CHEN XIANGDONG12 citations84
US8062951B2Nov 22, 2011
Method to increase effective MOSFET width
CHEN XIANGDONG8 citations84
US8445969B2May 21, 2013
High pressure deuterium treatment for semiconductor/high-K insulator interface
CHEN XIANGDONG8 citations83
US8298897B2Oct 30, 2012
Asymmetric channel MOSFET
CHEN XIANGDONG8 citations83
US8269275B2Sep 18, 2012
Method for fabricating a MOS transistor with reduced channel length variation and related structure
CHEN XIANGDONG9 citations83
US8237197B2Aug 7, 2012
Asymmetric channel MOSFET
CHEN XIANGDONG7 citations83
US9041153B2May 26, 2015
MIM capacitor having a local interconnect metal electrode and related structure
CHEN XIANGDONG7 citations81
QUALCOMM INC
7 patentsUS9831272B2Nov 28, 2017
Metal oxide semiconductor cell device architecture with mixed diffusion break isolation trenches
QUALCOMM INC26 citations93
US9755618B1Sep 5, 2017
Low-area low clock-power flip-flop
QUALCOMM INC7 citations84
US9634026B1Apr 25, 2017
Standard cell architecture for reduced leakage current and improved decoupling capacitance
QUALCOMM INC8 citations83
US9379058B2Jun 28, 2016
Grounding dummy gate in scaled layout design
QUALCOMM INC13 citations83
US9318476B2Apr 19, 2016
High performance standard cell with continuous oxide definition and characterized leakage current
QUALCOMM INC16 citations83
US9640522B1May 2, 2017
V1 and higher layers programmable ECO standard cells
QUALCOMM INC13 citations82
US9331016B2May 3, 2016
SOC design with critical technology pitch alignment
QUALCOMM INC10 citations82
KARIKALAN SAMPATH K V
3 patentsUS8928128B2Jan 6, 2015
Semiconductor package with integrated electromagnetic shielding
KARIKALAN SAMPATH K V37 citations93
US9059179B2Jun 16, 2015
Semiconductor package with a bridge interposer
KARIKALAN SAMPATH K V27 citations91
US9013041B2Apr 21, 2015
Semiconductor package with ultra-thin interposer without through-semiconductor vias
KARIKALAN SAMPATH K V7 citations83
BROADCOM CORP
3 patentsTAIWAN SEMICONDUCTOR MFG CO LTD
2 patentsZHAO SAM ZIQUN
2 patentsUNIV TEXAS
1 patentFORD GLOBAL TECH LLC
1 patentCAI JIN
1 patentKHAN REZAUR RAHMAN
1 patentHUI FRANK
1 patentShowing the top 50 of 167 patents by PatentIndex Score.