Inventor

GRUBER PETER A

US98 patents

⚠️ This page may combine multiple inventors who share the name “GRUBER PETER A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRUBER PETER A

IBM

Compliant fluidic coolant hat

Double solder bumps on substrates for low temperature flip chip bonding

Common ball-limiting metallurgy for I/O sites

Apparatus and method for injection molding solder and applications thereof

Flexible finned heat exchanger

Cast metal seal for semiconductor substrates

Cast metal seal for semiconductor substrates and process thereof

Liquid metal matrix thermal paste

Flexible finned heat exchanger

Semiconductor structure with solder bumps

Electrical interconnect structure and method

Injection molded microoptics

Method for forming three-dimensional circuitization and circuits formed

Thermal joint

Liquid metal matrix thermal paste

Injection molded solder method for forming solder bumps on substrates

Global vacuum injection molded solder system and method

Techniques for forming interconnects

Bilayer wafer-level underfill

Apparatus and method for filling high aspect ratio via holes in electronic substrates

Apparatus for filling high aspect ratio via holes in electronic substrates

Flexible finned heat exchanger

Fluxless solder transfer and reflow process

Method for direct chip attach by solder bumps and an underfill layer

Method for direct chip attach by solder bumps and an underfill layer

Low temperature solder column attach by injection molded solder and structure formed

Forming an array of metal balls or shapes on a substrate

Die level integrated interconnect decal manufacturing method and apparatus

Sprocket opening alignment process and apparatus for multilayer solder decal

Solder interconnect structure and method using injection molded solder

Method of producing coaxial solder bump connections using injection molding of solder

High-temperature alloy standoffs for injection molding of solder

Rotational fill techniques for injection molding of solder

Fill head for injection molding of solder

Forming of high aspect ratio conductive structure using injection molded solder

Method for testing chips on flat solder bumps

Ultrasonic method and actuator for inducing motion of an object

Injection molded microoptics

Conductive bonding material fill techniques

Reduced volume interconnect for three-dimensional chip stack

Reduced volume interconnect for three-dimensional chip stack

GRUBER PETER A

Double solder bumps on substrates for low temperature flip chip bonding

Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold

Metal cored solder decal structure and process

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

Spherical solder reflow method

Wafer level integrated interconnect decal and manufacturing method thereof

BUCHWALTER STEPHEN L

Micro-fluidic injection molded solder (IMS)

INTERNAT BUSINSS MACHINES CORP

Micro-fluidic injection molded solder (IMS)

CORDES STEVEN A

Direct edge connection for multi-chip integrated circuits