Inventor

ARCHER III VANCE D

US4 patents

⚠️ This page may combine multiple inventors who share the name “ARCHER III VANCE D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AGERE SYSTEMS INC

3 patents

US7429502B2Sep 30, 2008

Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink

AGERE SYSTEMS INC23 citations91

US7327029B2Feb 5, 2008

Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink

AGERE SYSTEMS INC3 citations61

US7973544B2Jul 5, 2011

Thermal monitoring and management of integrated circuits

AGERE SYSTEMS INC0 citations50

ARCHER III VANCE D

1 patent

US8319343B2Nov 27, 2012

Routing under bond pad for the replacement of an interconnect layer

ARCHER III VANCE D13 citations78