Inventor

SHIAN TI CHING

ML4 patents

⚠️ This page may combine multiple inventors who share the name “SHIAN TI CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FAIRCHILD SEMICONDUCTOR

2 patents

US7285849B2Oct 23, 2007

Semiconductor die package using leadframe and clip and method of manufacturing

FAIRCHILD SEMICONDUCTOR114 citations96

US7638861B2Dec 29, 2009

Flip chip MLP with conductive ink

FAIRCHILD SEMICONDUCTOR14 citations82

CRUZ ERWIN VICTOR R

1 patent

US8058107B2Nov 15, 2011

Semiconductor die package using leadframe and clip and method of manufacturing

CRUZ ERWIN VICTOR R10 citations77

CHOI SEUNG-YONG

1 patent

US9147627B2Sep 29, 2015

Flip chip MLP with conductive ink

CHOI SEUNG-YONG0 citations45