Inventor
SIEGEL HARRY MICHAEL
US17 patents
⚠️ This page may combine multiple inventors who share the name “SIEGEL HARRY MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS INC
16 patentsUS7595017B2Sep 29, 2009
Method for using a pre-formed film in a transfer molding process for an integrated circuit
ST MICROELECTRONICS INC21 citations92
US7109574B2Sep 19, 2006
Integrated circuit package with exposed die surfaces and auxiliary attachment
ST MICROELECTRONICS INC43 citations92
US6785137B2Aug 31, 2004
Method and system for removing heat from an active area of an integrated circuit device
ST MICROELECTRONICS INC23 citations92
US6771500B1Aug 3, 2004
System and method for direct convective cooling of an exposed integrated circuit die surface
ST MICROELECTRONICS INC34 citations92
US5994774ANov 30, 1999
Surface mountable integrated circuit package with detachable module and interposer
ST MICROELECTRONICS INC33 citations88
US7098065B2Aug 29, 2006
Integrated lid formed on MEMS device
ST MICROELECTRONICS INC18 citations84
US6603192B2Aug 5, 2003
Scratch resistance improvement by filling metal gaps
ST MICROELECTRONICS INC17 citations84
US6372543B1Apr 16, 2002
Wrap-around interconnect for fine pitch ball grid array
ST MICROELECTRONICS INC10 citations72
US6121678ASep 19, 2000
Wrap-around interconnect for fine pitch ball grid array
ST MICROELECTRONICS INC15 citations72
US7096581B2Aug 29, 2006
Method for providing a redistribution metal layer in an integrated circuit
ST MICROELECTRONICS INC7 citations70
US6900508B2May 31, 2005
Embedded flat film molding
ST MICROELECTRONICS INC3 citations63
US6600227B1Jul 29, 2003
System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
ST MICROELECTRONICS INC2 citations63
US7786582B2Aug 31, 2010
System for providing a redistribution metal layer in an integrated circuit
ST MICROELECTRONICS INC4 citations62
US7456050B2Nov 25, 2008
System and method for controlling integrated circuit die height and planarity
ST MICROELECTRONICS INC4 citations60
US7202110B2Apr 10, 2007
Embedded flat film molding
ST MICROELECTRONICS INC1 citations52
US6951125B2Oct 4, 2005
System and method for aligning an integrated circuit die on an integrated circuit substrate
ST MICROELECTRONICS INC0 citations52