Inventor
DHAVALESWARAPU HEMANTH
US4 patents
Patents
4 patentsUS9282650B2Mar 8, 2016
Thermal compression bonding process cooling manifold
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US9748199B2Aug 29, 2017
Thermal compression bonding process cooling manifold
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US12599050B2Apr 7, 2026
Multi-level die coupled with a substrate
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US9548284B2Jan 17, 2017
Reduced expansion thermal compression bonding process bond head
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