Inventor
KIYONO SHINYA
JP5 patents
Patents
5 patentsUS11552020B2Jan 10, 2023
Semiconductor composite device and package board used therein
MURATA MANUFACTURING CO0 citations59
US11121123B2Sep 14, 2021
Semiconductor composite device and package board used therein
MURATA MANUFACTURING CO0 citations59
US10177108B2Jan 8, 2019
Method of manufacturing electronic component module and electronic component module
MURATA MANUFACTURING CO0 citations47
US9532495B2Dec 27, 2016
Method of manufacturing electronic component module and electronic component module
MURATA MANUFACTURING CO0 citations47
US9860989B2Jan 2, 2018
Electronic component module and method for manufacturing electronic component module
MURATA MANUFACTURING CO1 citations44