Inventor
WANG WEIHAO
CN13 patents
⚠️ This page may combine multiple inventors who share the name “WANG WEIHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
Zhejiang Lab
5 patentsUS11776879B1Oct 3, 2023
Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof
Zhejiang Lab1 citations57
US11983481B2May 14, 2024
Software-defined wafer-level switching system design method and apparatus
Zhejiang Lab0 citations48
US12112115B2Oct 8, 2024
Routing structure and method of wafer substrate with standard integration zone for integration on-wafer
Zhejiang Lab0 citations47
US11887964B1Jan 30, 2024
Wafer-level heterogeneous dies integration structure and method
Zhejiang Lab0 citations47
US11876071B1Jan 16, 2024
System-on-wafer structure and fabrication method
Zhejiang Lab0 citations46