Inventor
LEE JAE KUL
KR17 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE KUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
8 patentsUS7947906B2May 24, 2011
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH19 citations92
US7394249B2Jul 1, 2008
Printed circuit board with weak magnetic field sensor
SAMSUNG ELECTRO MECH7 citations73
US10748828B2Aug 18, 2020
Fan-out sensor package
SAMSUNG ELECTRO MECH3 citations71
US10615212B2Apr 7, 2020
Fan-out sensor package
SAMSUNG ELECTRO MECH6 citations71
US8011086B2Sep 6, 2011
Method of manufacturing a component-embedded printed circuit board
SAMSUNG ELECTRO MECH2 citations61
US9035196B2May 19, 2015
Circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US7812465B2Oct 12, 2010
Semiconductor chip having alignment mark and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations51
US9907182B2Feb 27, 2018
Method of manufacturing insulation film and printed circuit board
SAMSUNG ELECTRO MECH0 citations45
SAMSUNG ELECTRONICS CO LTD
5 patentsUS10847476B2Nov 24, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10629641B2Apr 21, 2020
Fan-out sensor package and optical-type fingerprint sensor module including the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10741498B2Aug 11, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations63
US10692791B2Jun 23, 2020
Electronic component package with electromagnetic wave shielding
SAMSUNG ELECTRONICS CO LTD0 citations39
US10438927B2Oct 8, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations39