Inventor
CALL ANSON J
US24 patents
Patents
24 patentsUS6333563B1Dec 25, 2001
Electrical interconnection package and method thereof
IBM85 citations97
US5533256AJul 9, 1996
Method for directly joining a chip to a heat sink
IBM102 citations96
US5471027ANov 28, 1995
Method for forming chip carrier with a single protective encapsulant
IBM132 citations96
US5147084ASep 15, 1992
Interconnection structure and test method
IBM175 citations96
US5060844AOct 29, 1991
Interconnection structure and test method
IBM184 citations96
US6297559B1Oct 2, 2001
Structure, materials, and applications of ball grid array interconnections
IBM55 citations95
US6218629B1Apr 17, 2001
Module with metal-ion matrix induced dendrites for interconnection
IBM18 citations92
US6300164B1Oct 9, 2001
Structure, materials, and methods for socketable ball grid
IBM42 citations91
US6120885ASep 19, 2000
Structure, materials, and methods for socketable ball grid
IBM25 citations91
US5759285AJun 2, 1998
Method and solution for cleaning solder connections of electronic components
IBM6 citations74
US10276534B2Apr 30, 2019
Reduction of solder interconnect stress
IBM2 citations73
US9633914B2Apr 25, 2017
Split ball grid array pad for multi-chip modules
IBM2 citations70
US9865557B1Jan 9, 2018
Reduction of solder interconnect stress
IBM1 citations63
US10607928B1Mar 31, 2020
Reduction of laminate failure in integrated circuit (IC) device carrier
IBM1 citations62
US6584684B2Jul 1, 2003
Method for assembling a carrier and a semiconductor device
IBM3 citations62
US10956649B2Mar 23, 2021
Semiconductor package metal shadowing checks
IBM0 citations61
US10276535B2Apr 30, 2019
Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress
IBM0 citations52
US9563732B1Feb 7, 2017
In-plane copper imbalance for warpage prediction
IBM1 citations52
US7786579B2Aug 31, 2010
Apparatus for crack prevention in integrated circuit packages
IBM1 citations52
US10546096B2Jan 28, 2020
Semiconductor package via stack checking
IBM0 citations51
US10423752B2Sep 24, 2019
Semiconductor package metal shadowing checks
IBM0 citations51
US10483233B2Nov 19, 2019
Split ball grid array pad for multi-chip modules
IBM0 citations49
US10108753B2Oct 23, 2018
Laminate substrate thermal warpage prediction for designing a laminate substrate
IBM0 citations42
US10770385B2Sep 8, 2020
Connected plane stiffener within integrated circuit chip carrier
IBM0 citations41