Inventor
LAI YU-TSUNG
TW45 patents
⚠️ This page may combine multiple inventors who share the name “LAI YU-TSUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
34 patentsUS7378343B2May 27, 2008
Dual damascence process utilizing teos-based silicon oxide cap layer having reduced carbon content
UNITED MICROELECTRONICS CORP20 citations91
US8883648B1Nov 11, 2014
Manufacturing method of semiconductor structure
UNITED MICROELECTRONICS CORP28 citations89
US9741614B1Aug 22, 2017
Method of preventing trench distortion
UNITED MICROELECTRONICS CORP12 citations84
US8993433B2Mar 31, 2015
Manufacturing method for forming a self aligned contact
UNITED MICROELECTRONICS CORP9 citations84
US10916694B2Feb 9, 2021
Magnetoresistive random access memory (MRAM) device
UNITED MICROELECTRONICS CORP2 citations73
US10903269B2Jan 26, 2021
Magnetic memory device and fabrication method thereof
UNITED MICROELECTRONICS CORP4 citations73
US9779942B1Oct 3, 2017
Method of forming patterned mask layer
UNITED MICROELECTRONICS CORP3 citations73
US11387408B2Jul 12, 2022
Magnetoresistive random access memory and method of manufacturing the same
UNITED MICROELECTRONICS CORP1 citations72
US10910553B1Feb 2, 2021
Magnetoresistive random access memory and method of manufacturing the same
UNITED MICROELECTRONICS CORP1 citations72
US10636744B2Apr 28, 2020
Memory device including alignment mark trench
UNITED MICROELECTRONICS CORP2 citations72
US9773860B1Sep 26, 2017
Capacitor and method for fabricating the same
UNITED MICROELECTRONICS CORP4 citations72
US7767578B2Aug 3, 2010
Damascene interconnection structure and dual damascene process thereof
UNITED MICROELECTRONICS CORP5 citations72
US8350246B2Jan 8, 2013
Structure of porous low-k layer and interconnect structure
UNITED MICROELECTRONICS CORP2 citations63
US7947565B2May 24, 2011
Forming method of porous low-k layer and interconnect process
UNITED MICROELECTRONICS CORP4 citations63
US12557557B2Feb 17, 2026
Method for fabricating magnetoresistive random access memory (MRAM) device
UNITED MICROELECTRONICS CORP0 citations62
US12527230B2Jan 13, 2026
Magnetoresistive random access memory device
UNITED MICROELECTRONICS CORP0 citations62
US12471498B2Nov 11, 2025
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US12349367B2Jul 1, 2025
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US12133474B2Oct 29, 2024
Magnetoresistive random access memory and method of manufacturing the same
UNITED MICROELECTRONICS CORP0 citations62
US11812669B2Nov 7, 2023
Magnetoresistive random access memory and method of manufacturing the same
UNITED MICROELECTRONICS CORP0 citations62
US11785785B2Oct 10, 2023
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11778922B2Oct 3, 2023
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11737370B2Aug 22, 2023
Magnetoresistive random access memory (MRAM) device
UNITED MICROELECTRONICS CORP0 citations62
US11706993B2Jul 18, 2023
Method of manufacturing magnetoresistive random access memory (MRAM) device
UNITED MICROELECTRONICS CORP0 citations62
US11545522B2Jan 3, 2023
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11283007B2Mar 22, 2022
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11271154B2Mar 8, 2022
Magnetic tunnel junction (MTJ) device
UNITED MICROELECTRONICS CORP0 citations62
US11121307B2Sep 14, 2021
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11056536B2Jul 6, 2021
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US10847709B1Nov 24, 2020
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP1 citations62
US7977244B2Jul 12, 2011
Semiconductor manufacturing process
UNITED MICROELECTRONICS CORP6 citations61
US10804138B2Oct 13, 2020
Method for fabricating a semiconductor device
UNITED MICROELECTRONICS CORP0 citations52
US10699913B2Jun 30, 2020
Manufacturing method for trench
UNITED MICROELECTRONICS CORP0 citations52
US9230812B2Jan 5, 2016
Method for forming semiconductor structure having opening
UNITED MICROELECTRONICS CORP0 citations42
LEE CHANG-HSIAO
4 patentsUS8735295B2May 27, 2014
Method of manufacturing dual damascene structure
LEE CHANG-HSIAO2 citations58
US8277674B2Oct 2, 2012
Method of removing post-etch residues
LEE CHANG-HSIAO0 citations47
US8137472B2Mar 20, 2012
Semiconductor process
LEE CHANG-HSIAO0 citations47
US8592304B2Nov 26, 2013
Method for filling metal
LEE CHANG-HSIAO0 citations37