Inventor

PANDEY DEEPAK CHANDRA

IN36 patents

⚠️ This page may combine multiple inventors who share the name “PANDEY DEEPAK CHANDRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PANDEY DEEPAK CHANDRA

MICRON TECHNOLOGY INC

Channel conduction in semiconductor devices

Metal insulator semiconductor (MIS) contact in three dimensional (3D) vertical memory

Method of forming an array of vertical transistors

Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies

Devices and systems with string drivers including high band gap material and methods of formation

Methods of forming integrated assemblies

Integrated assemblies having threshold-voltage-inducing-structures proximate gated-channel-regions, and methods of forming integrated assemblies

Apparatuses having body connection lines coupled with access devices

Apparatuses having body connection lines coupled with access devices

Electronic component of integrated circuitry and a method of forming a conductive via to a region of semiconductor material

Semiconductor devices including a recessed access device and methods of forming same

Methods of forming transistors

Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies

Array of vertical transistors having channel regions connected by an elongated conductor line

Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies

Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material

Access devices formed with conductive contacts

Integrated assemblies having void regions between digit lines and conductive structures, and methods of forming integrated assemblies

Integrated assemblies having threshold-voltage-inducing-structures proximate gated-channel-regions, and methods of forming integrated assemblies

Channel conduction in semiconductor devices

Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material

Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assemblies

Microelectronic devices including passing word line structures, and related electronic systems and methods

Apparatuses including passing word lines comprising a band offset material, and related methods and systems

Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assemblies

Access devices formed with conductive contacts

Transistors and memory arrays

Methods of forming a transistor and methods of forming an array of memory cells

Apparatuses having compensator lines along wordlines and independently controlled relative to the wordlines

Electronic component of integrated circuitry and a method of forming a conductive via to a region of semiconductor material

Transistors and memory arrays

Methods of forming transistors

Semiconductor structure formation at differential depths

Recessed access devices and DRAM constructions

LODESTAR LICENSING GROUP LLC

Channel conduction in semiconductor devices