Inventor
SHEU TZU-SHIUN
TW7 patents
Patents
7 patentsUS9812426B1Nov 7, 2017
Integrated fan-out package, semiconductor device, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations83
US9524942B2Dec 20, 2016
Chip-on-substrate packaging on carrier
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US12176299B2Dec 24, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11587887B2Feb 21, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10679951B2Jun 9, 2020
Chip-on-substrate packaging on carrier
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10163822B2Dec 25, 2018
Chip-on-substrate packaging on carrier
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9922943B2Mar 20, 2018
Chip-on-substrate packaging on carrier
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51