Inventor
TEO LEE-WEE
SG74 patents
⚠️ This page may combine multiple inventors who share the name “TEO LEE-WEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS10658492B2May 19, 2020
Polysilicon design for replacement gate technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10403736B2Sep 3, 2019
Polysilicon design for replacement gate technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9412841B2Aug 9, 2016
Method of fabricating a transistor using contact etch stop layers
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10084061B2Sep 25, 2018
Polysilicon design for replacement gate technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9929251B2Mar 27, 2018
Polysilicon design for replacement gate technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9679988B2Jun 13, 2017
Polysilicon design for replacement gate technology
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12426333B2Sep 23, 2025
Polysilicon design for replacement gate technology
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11018241B2May 25, 2021
Polysilicon design for replacement gate technology
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
7 patentsUS8557659B2Oct 15, 2013
Spacer structures of a semiconductor device
TAIWAN SEMICONDUCTOR MFG23 citations92
USRE45060EAug 5, 2014
Spacer structures of a semiconductor device
TAIWAN SEMICONDUCTOR MFG4 citations84
US8349678B2Jan 8, 2013
Laterally diffused metal oxide semiconductor transistor with partially unsilicided source/drain
TAIWAN SEMICONDUCTOR MFG13 citations84
US8981495B2Mar 17, 2015
Laterally diffused metal oxide semiconductor transistor with partially unsilicided source/drain
TAIWAN SEMICONDUCTOR MFG4 citations73
US8772147B2Jul 8, 2014
Spacer structures of a semiconductor device
TAIWAN SEMICONDUCTOR MFG3 citations63
US8378428B2Feb 19, 2013
Metal gate structure of a semiconductor device
TAIWAN SEMICONDUCTOR MFG3 citations63
US9105692B2Aug 11, 2015
Method of fabricating an interconnection structure in a CMOS comprising a step of forming a dummy electrode
TAIWAN SEMICONDUCTOR MFG2 citations62
CHARTERED SEMICONDUCTOR MFG
6 patentsUS7592270B2Sep 22, 2009
Modulation of stress in stress film through ion implantation and its application in stress memorization technique
CHARTERED SEMICONDUCTOR MFG58 citations98
US7727856B2Jun 1, 2010
Selective STI stress relaxation through ion implantation
CHARTERED SEMICONDUCTOR MFG10 citations82
US7692213B2Apr 6, 2010
Integrated circuit system employing a condensation process
CHARTERED SEMICONDUCTOR MFG6 citations72
US6962850B2Nov 8, 2005
Process to manufacture nonvolatile MOS memory device
CHARTERED SEMICONDUCTOR MFG7 citations68
US7935589B2May 3, 2011
Enhanced stress for transistors
CHARTERED SEMICONDUCTOR MFG4 citations63
US7846800B2Dec 7, 2010
Avoiding plasma charging in integrated circuits
CHARTERED SEMICONDUCTOR MFG6 citations63
TEO LEE-WEE
5 patentsUS8304840B2Nov 6, 2012
Spacer structures of a semiconductor device
TEO LEE-WEE12 citations92
US8614484B2Dec 24, 2013
High voltage device with partial silicon germanium epi source/drain
TEO LEE-WEE16 citations84
US8450216B2May 28, 2013
Contact etch stop layers of a field effect transistor
TEO LEE-WEE8 citations84
US8389359B2Mar 5, 2013
Method for forming low resistance and uniform metal gate
TEO LEE-WEE9 citations84
US8525270B2Sep 3, 2013
Structures and methods to stop contact metal from extruding into replacement gates
TEO LEE-WEE6 citations82
TAN SHYUE SENG
5 patentsUS8324031B2Dec 4, 2012
Diffusion barrier and method of formation thereof
TAN SHYUE SENG10 citations84
US8211761B2Jul 3, 2012
Semiconductor system using germanium condensation
TAN SHYUE SENG17 citations84
US8647946B2Feb 11, 2014
Control gate
TAN SHYUE SENG8 citations83
US9159565B2Oct 13, 2015
Integrated circuit system with band to band tunneling and method of manufacture thereof
TAN SHYUE SENG2 citations63
US8969151B2Mar 3, 2015
Integrated circuit system employing resistance altering techniques
TAN SHYUE SENG3 citations63
TEO LEE WEE
4 patentsUS8716081B2May 6, 2014
Capacitor top plate over source/drain to form a 1T memory device
TEO LEE WEE4 citations72
US8119541B2Feb 21, 2012
Modulation of stress in stress film through ion implantation and its application in stress memorization technique
TEO LEE WEE3 citations63
US8530310B2Sep 10, 2013
Memory cell with improved retention
TEO LEE WEE2 citations62
US8274115B2Sep 25, 2012
Hybrid orientation substrate with stress layer
TEO LEE WEE4 citations62
GLOBALFOUNDRIES SG PTE LTD
4 patentsUS7998835B2Aug 16, 2011
Strain-direct-on-insulator (SDOI) substrate and method of forming
GLOBALFOUNDRIES SG PTE LTD4 citations63
US7888214B2Feb 15, 2011
Selective stress relaxation of contact etch stop layer through layout design
GLOBALFOUNDRIES SG PTE LTD5 citations63
US8053327B2Nov 8, 2011
Method of manufacture of an integrated circuit system with self-aligned isolation structures
GLOBALFOUNDRIES SG PTE LTD3 citations62
US8008744B2Aug 30, 2011
Selective STI stress relaxation through ion implantation
GLOBALFOUNDRIES SG PTE LTD2 citations61
CHUANG HARRY HAK-LAY
3 patentsUS8890260B2Nov 18, 2014
Polysilicon design for replacement gate technology
CHUANG HARRY HAK-LAY14 citations92
US8183644B1May 22, 2012
Metal gate structure of a CMOS semiconductor device
CHUANG HARRY HAK-LAY27 citations92
US8697517B2Apr 15, 2014
Reduced substrate coupling for inductors in semiconductor devices
CHUANG HARRY HAK-LAY2 citations63
CHEW HAN-GUAN
3 patentsZHU MING
2 patentsUTOMO HENRY K
1 patentCHUANG HAK-LAY
1 patentCHUANG HARRY-HAK-LAY
1 patentShowing the top 50 of 74 patents by PatentIndex Score.