Inventor
ARAI TSUNEHARU
JP7 patents
Patents
7 patentsUS5725728AMar 10, 1998
Pellet pick-up device
SHINKAWA KK32 citations91
US6547902B2Apr 15, 2003
Die bonding method and apparatus
SHINKAWA KK20 citations90
US5853532ADec 29, 1998
Wafer ring supply and return device
SHINKAWA KK9 citations73
US5824185AOct 20, 1998
Wafer ring supply and return device
SHINKAWA KK14 citations73
US6062795AMay 16, 2000
Wafer ring feeding apparatus
SHINKAWA KK8 citations72
US5603446AFeb 18, 1997
Bonding apparatus
SHINKAWA KK12 citations72
US5823418AOct 20, 1998
Die transporting device
SHINKAWA KK2 citations62