Inventor · disambiguated record
Kenichi Sakaguchi
Also filed as: SAKAGUCHI KENICHI
6 granted patents·1 pending application·168 citations·filing 1985–2007
86Inventor score
Top patents by PatentIndex Score
7 records- 0192US4640673ACompression molding apparatusTOYO SEIKAN KAISHA LTD·Filed 1985·Granted Feb 3, 1987·73 cites·31 claims
- 0271US4755125ACompression molding apparatusTOYO SEIKAN KAISHA LTD·Filed 1986·Granted Jul 5, 1988·28 cites·3 claims
- 0361US6097101APackage for semiconductor device having frame-like molded portion and producing method of the sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Aug 1, 2000·27 cites·19 claims
- 0456US6577000B2Premold type semiconductor packageSHINKO ELECTRIC IND CO LD·Filed 2001·Granted Jun 10, 2003·9 cites·9 claims
- 0553US6333211B1Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumpsSHINKO ELECTRIC IND CO·Filed 1999·Granted Dec 25, 2001·17 cites·4 claims
- 0646US5945688AOptical semiconductor device and lead frame used in such a deviceSHINKO ELECTRIC IND CO·Filed 1998·Granted Aug 31, 1999·14 cites·12 claims
- 0742US2008067654A1Electronic component package and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
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