Inventor
HOEBENER KARL G
US8 patents
⚠️ This page may combine multiple inventors who share the name “HOEBENER KARL G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS5492266AFeb 20, 1996
Fine pitch solder deposits on printed circuit board process and product
IBM195 citations97
US5591941AJan 7, 1997
Solder ball interconnected assembly
IBM183 citations96
US5147084ASep 15, 1992
Interconnection structure and test method
IBM175 citations96
US5060844AOct 29, 1991
Interconnection structure and test method
IBM184 citations96
US4919970AApr 24, 1990
Solder deposition control
IBM28 citations92
US4761881AAug 9, 1988
Single step solder process
IBM94 citations91
US4998342AMar 12, 1991
Method of attaching electronic components
IBM30 citations87