Inventor
KUNNEN EDDY
BE8 patents
⚠️ This page may combine multiple inventors who share the name “KUNNEN EDDY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IMEC INTER UNI MICRO ELECTR
4 patentsUS7338896B2Mar 4, 2008
Formation of deep via airgaps for three dimensional wafer to wafer interconnect
IMEC INTER UNI MICRO ELECTR299 citations95
US7400024B2Jul 15, 2008
Formation of deep trench airgaps and related applications
IMEC INTER UNI MICRO ELECTR48 citations94
US7396732B2Jul 8, 2008
Formation of deep trench airgaps and related applications
IMEC INTER UNI MICRO ELECTR29 citations90
US7060587B2Jun 13, 2006
Method for forming macropores in a layer and products obtained thereof
IMEC INTER UNI MICRO ELECTR6 citations68