Inventor

CARBONELL LAURE ELISA

FR2 patents

⚠️ This page may combine multiple inventors who share the name “CARBONELL LAURE ELISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IMEC INTER UNI MICRO ELECTR

1 patent

US7338896B2Mar 4, 2008

Formation of deep via airgaps for three dimensional wafer to wafer interconnect

IMEC INTER UNI MICRO ELECTR299 citations95

IMEC VZW

1 patent

US9997458B2Jun 12, 2018

Method for manufacturing germamde interconnect structures and corresponding interconnect structures

IMEC VZW0 citations47