Inventor
SHI LEI
CN379 patents
⚠️ This page may combine multiple inventors who share the name “SHI LEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHI LEI
8 patentsUS9544671B2Jan 10, 2017
Speaker-box
SHI LEI20 citations90
US8680658B2Mar 25, 2014
Conductive clip for semiconductor device package
SHI LEI14 citations84
US8338232B2Dec 25, 2012
Power semiconductor device package method
SHI LEI8 citations84
US8306806B2Nov 6, 2012
Adaptive web mining of bilingual lexicon
SHI LEI11 citations84
US9694100B2Jul 4, 2017
Enzymatic wound debriding compositions with enhanced enzymatic activity
SHI LEI6 citations82
US8649550B2Feb 11, 2014
Multi-magnet system and speaker using same
SHI LEI9 citations82
US8630441B2Jan 14, 2014
Multi-magnetic speaker
SHI LEI13 citations82
US8531646B2Sep 10, 2013
Tunable liquid crystal devices, devices using same, and methods of making and using same
SHI LEI12 citations79
ALPHA & OMEGA SEMICONDUCTOR
6 patentsUS8354740B2Jan 15, 2013
Top-side cooled semiconductor package with stacked interconnection plates and method
ALPHA & OMEGA SEMICONDUCTOR27 citations93
US7683464B2Mar 23, 2010
Semiconductor package having dimpled plate interconnections
ALPHA & OMEGA SEMICONDUCTOR25 citations93
US7622796B2Nov 24, 2009
Semiconductor package having a bridged plate interconnection
ALPHA & OMEGA SEMICONDUCTOR31 citations93
US9218987B2Dec 22, 2015
Method for top-side cooled semiconductor package with stacked interconnection plates
ALPHA & OMEGA SEMICONDUCTOR7 citations84
US7943424B1May 17, 2011
Encapsulation method for packaging semiconductor components with external leads
ALPHA & OMEGA SEMICONDUCTOR8 citations84
US7884469B2Feb 8, 2011
Semiconductor package having a bridged plate interconnection
ALPHA & OMEGA SEMICONDUCTOR9 citations84
HUAWEI TECH CO LTD
4 patentsUS10903758B2Jan 26, 2021
Hybrid multilevel inverters with reduced voltage stress
HUAWEI TECH CO LTD15 citations86
US10177683B2Jan 8, 2019
Multi-level inverter
HUAWEI TECH CO LTD15 citations86
US9787217B2Oct 10, 2017
Power conversion circuit and power conversion system
HUAWEI TECH CO LTD12 citations83
US9215029B2Dec 15, 2015
Path selecting method and apparatus
HUAWEI TECH CO LTD11 citations83
XUE YAN XUN
4 patentsUS8778735B1Jul 15, 2014
Packaging method of molded wafer level chip scale package (WLCSP)
XUE YAN XUN14 citations84
US8563361B2Oct 22, 2013
Packaging method of molded wafer level chip scale package (WLCSP)
XUE YAN XUN8 citations84
US8564110B2Oct 22, 2013
Power device with bottom source electrode
XUE YAN XUN12 citations84
US8436429B2May 7, 2013
Stacked power semiconductor device using dual lead frame and manufacturing method
XUE YAN XUN13 citations84
ENCODIA INC
3 patentsUS11513126B2Nov 29, 2022
Kits for analysis using nucleic acid encoding and/or label
ENCODIA INC15 citations93
US11782062B2Oct 10, 2023
Kits for analysis using nucleic acid encoding and/or label
ENCODIA INC9 citations85
US11427814B2Aug 30, 2022
Modified cleavases, uses thereof and related kits
ENCODIA INC8 citations82
BUNNELLE WILLIAM H
2 patentsMICROSOFT CORP
2 patentsHK APPLIED SCIENCE & TECH RES
2 patentsNANTONG FUJITSU MICROELECT CO
2 patentsLU JUN
1 patentLIU KAI
1 patentSCHRIMPF MICHAEL R
1 patentOLYMPUS OPTICAL CO
1 patentCHEN XIAO YAN
1 patentYANG DENG-KE
1 patentGENETICS INST
1 patentSHEN QINGNI
1 patentUNIV KENT STATE OHIO
1 patentABBVIE INC
1 patentMONSANTO TECHNOLOGY LLC
1 patentROCHE GLYCART AG
1 patentTONGYU COMMUNICATION INC
1 patentOPERA SOLUTIONS LLC
1 patentSHI ZHENGYU
1 patentEXXONMOBIL CHEMICAL PATENTS INC
1 patentBOS PHILIP
1 patentShowing the top 50 of 379 patents by PatentIndex Score.