Inventor

NG CHEONG CHIANG

MY3 patents

⚠️ This page may combine multiple inventors who share the name “NG CHEONG CHIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ONG YOU YANG

1 patent

US8163604B2Apr 24, 2012

Integrated circuit package system using etched leadframe

ONG YOU YANG15 citations76

NXP USA INC

1 patent

US12119316B2Oct 15, 2024

Patterned and planarized under-bump metallization

NXP USA INC0 citations56

FREESCALE SEMICONDUCTOR INC

1 patent

US8836092B2Sep 16, 2014

Semiconductor device with thermal dissipation lead frame

FREESCALE SEMICONDUCTOR INC0 citations36