Inventor

SENZAI HIROYUKI

JP6 patents

⚠️ This page may combine multiple inventors who share the name “SENZAI HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NITTO DENKO CORP

4 patents

US9085685B2Jul 21, 2015

Under-fill material and method for producing semiconductor device

NITTO DENKO CORP2 citations60

US9472439B2Oct 18, 2016

Reinforcing sheet and method for producing secondary mounted semiconductor device

NITTO DENKO CORP1 citations50

US9368421B2Jun 14, 2016

Under-fill material and method for producing semiconductor device

NITTO DENKO CORP0 citations50

US8951843B2Feb 10, 2015

Laminated sheet and method of manufacturing semiconductor device using the laminated sheet

NITTO DENKO CORP0 citations35

ODA TAKASHI

2 patents

US9202795B2Dec 1, 2015

Laminated film and use thereof

ODA TAKASHI2 citations60

US8420510B2Apr 16, 2013

Method of manufacturing semiconductor device

ODA TAKASHI0 citations50