Inventor
CHUANG YONG-CHENG
TW9 patents
Patents
9 patentsUS9716080B1Jul 25, 2017
Thin fan-out multi-chip stacked package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC37 citations93
US10128211B2Nov 13, 2018
Thin fan-out multi-chip stacked package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC14 citations83
US9761568B2Sep 12, 2017
Thin fan-out multi-chip stacked packages and the method for manufacturing the same
POWERTECH TECHNOLOGY INC12 citations83
US9831219B2Nov 28, 2017
Manufacturing method of package structure
POWERTECH TECHNOLOGY INC6 citations82
US9659911B1May 23, 2017
Package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC3 citations72
US9859187B2Jan 2, 2018
Ball grid array package with protective circuitry layout and a substrate utilized in the package
POWERTECH TECHNOLOGY INC2 citations71
US10304716B1May 28, 2019
Package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC4 citations68
US9673178B2Jun 6, 2017
Method of forming package structure with dummy pads for bonding
POWERTECH TECHNOLOGY INC2 citations67
US10079222B2Sep 18, 2018
Package-on-package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations30