Inventor
LIN KUO-TING
TW10 patents
⚠️ This page may combine multiple inventors who share the name “LIN KUO-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
9 patentsUS9761568B2Sep 12, 2017
Thin fan-out multi-chip stacked packages and the method for manufacturing the same
POWERTECH TECHNOLOGY INC12 citations83
US9831219B2Nov 28, 2017
Manufacturing method of package structure
POWERTECH TECHNOLOGY INC6 citations82
US9899307B2Feb 20, 2018
Fan-out chip package with dummy pattern and its fabricating method
POWERTECH TECHNOLOGY INC4 citations72
US9716079B2Jul 25, 2017
Multi-chip package having encapsulation body to replace substrate core
POWERTECH TECHNOLOGY INC2 citations72
US9659911B1May 23, 2017
Package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC3 citations72
US10304716B1May 28, 2019
Package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC4 citations68
US9673178B2Jun 6, 2017
Method of forming package structure with dummy pads for bonding
POWERTECH TECHNOLOGY INC2 citations67
US10121736B2Nov 6, 2018
Method of fabricating packaging layer of fan-out chip package
POWERTECH TECHNOLOGY INC0 citations51
US9837384B2Dec 5, 2017
Fan-out multi-chip package with plurality of chips stacked in staggered stack arrangement
POWERTECH TECHNOLOGY INC1 citations51