Inventor
MILLIKEN JOHN C
US3 patents
Patents
3 patentsUS5490040AFeb 6, 1996
Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
IBM162 citations97
US5147084ASep 15, 1992
Interconnection structure and test method
IBM175 citations96
US5060844AOct 29, 1991
Interconnection structure and test method
IBM184 citations96