Inventor

OH SEUNG BAE

KR13 patents

⚠️ This page may combine multiple inventors who share the name “OH SEUNG BAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RORZE SYSTEMS CORP

3 patents

US10141210B2Nov 27, 2018

Purge module and load port having the same

RORZE SYSTEMS CORP3 citations65

US10395948B2Aug 27, 2019

Purge module jig and purge module having the same

RORZE SYSTEMS CORP1 citations61

US12283494B2Apr 22, 2025

Substrate transferring apparatus

RORZE SYSTEMS CORP0 citations44

SKC CO LTD

3 patents

US11747697B2Sep 5, 2023

Electrochromic device

SKC CO LTD0 citations47

US11852908B2Dec 26, 2023

Flexible electrochromic device

SKC CO LTD0 citations46

US11835832B2Dec 5, 2023

Flexible electrochromic device

SKC CO LTD0 citations46

SONG JEE-YUN

2 patents

US9018776B2Apr 28, 2015

Hardmask composition including aromatic ring-containing compound, method of forming patterns, and semiconductor integrated circuit device including the patterns

SONG JEE-YUN20 citations89

US9116429B2Aug 25, 2015

Resist underlayer polymer, resist underlayer composition including the same, and method of patterning using the same

SONG JEE-YUN3 citations60

CHO SUNG-WOOK

2 patents

US8637219B2Jan 28, 2014

Aromatic ring-containing compound for a resist underlayer and resist underlayer composition

CHO SUNG-WOOK6 citations69

US8617792B2Dec 31, 2013

Aromatic ring-containing polymer for resist underlayer, resist underlayer composition including the same, and method of patterning device using the same

CHO SUNG-WOOK0 citations48

OH SEUNG-BAE

1 patent

US8741539B2Jun 3, 2014

Hardmask composition, method of forming a pattern using the same, and semiconductor integrated circuit device including the pattern

OH SEUNG-BAE7 citations78

KIM MIN-SOO

1 patent

US8415424B2Apr 9, 2013

Aromatic ring-containing polymer for underlayer of resist and resist underlayer composition including the same

KIM MIN-SOO2 citations62

CHEIL IND INC

1 patent

US7947795B2May 24, 2011

Polymer for filling gaps in semiconductor substrate and coating composition using the same

CHEIL IND INC2 citations59