Inventor · disambiguated record
Ulrich Froehler
Also filed as: FROEHLER ULRICH
4 granted patents·1 pending application·6 citations·filing 2016–2021
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0191US11978693B2Semiconductor device package comprising side walls connected with contact pads of a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 7, 2024·2 cites·12 claims
- 0285US10566260B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 18, 2020·4 cites·19 claims
- 0358US10903133B2Method of producing an SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Jan 26, 2021·0 cites·19 claims
- 0440US9748116B2Electronic device and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 29, 2017·0 cites·7 claims
- 0532US2016379919A1Electronic device and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Application pending·0 cites
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