Inventor · disambiguated record
Nobuyuki Aoyagi
Also filed as: AOYAGI NOBUYUKI
12 granted patents·47 citations·filing 1992–2021
88Inventor score
Top patents by PatentIndex Score
12 records- 0189US12046574B2Ultrasonic horn and manufacturing apparatus of semiconductor deviceSHINKAWA KK·Filed 2021·Granted Jul 23, 2024·2 cites·5 claims
- 0278US8292160B2Method of manufacturing semiconductor device, and bonding apparatusMARUYA YUSUKE·Filed 2011·Granted Oct 23, 2012·10 cites·4 claims
- 0377US11376627B2Ultrasonic hornSHINKAWA KK·Filed 2016·Granted Jul 5, 2022·2 cites·2 claims
- 0467US8800843B2Bonding apparatusAOYAGI NOBUYUKI·Filed 2010·Granted Aug 12, 2014·3 cites·16 claims
- 0557US8181527B2Method and apparatus for pass/fail determination of bonding and bonding apparatusAOYAGI NOBUYUKI·Filed 2011·Granted May 22, 2012·1 cites·6 claims
- 0656US8540135B2Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the sameAOYAGI NOBUYUKI·Filed 2011·Granted Sep 24, 2013·1 cites·3 claims
- 0742US5332079AApparatus for conveying plate-form articlesSHINKAWA KK·Filed 1993·Granted Jul 26, 1994·9 cites·1 claims
- 0840US7754410B2Production method of static charge image developing toner and screen deviceMITSUBISHI CHEM CORP·Filed 2006·Granted Jul 13, 2010·0 cites·11 claims
- 0939US11824038B2Wire bonding apparatusSHINKAWA KK·Filed 2019·Granted Nov 21, 2023·0 cites·11 claims
- 1037US5307420AMethod and apparatus for monitoring plates in marking deviceSHINKAWA KK·Filed 1992·Granted Apr 26, 1994·5 cites·2 claims
- 1134US5372239AApparatus for conveying plate-form articlesSHINKAWA KK·Filed 1993·Granted Dec 13, 1994·7 cites·4 claims
- 1229US5881888AWafer die pick-up methodSHINKAWA KK·Filed 1996·Granted Mar 16, 1999·7 cites·2 claims
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