Inventor
BODENWEBER PAUL F
US22 patents
⚠️ This page may combine multiple inventors who share the name “BODENWEBER PAUL F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS10757833B2Aug 25, 2020
Cooling structure for electronic boards
IBM7 citations84
US10172258B2Jan 1, 2019
Cooling structure for electronic boards
IBM5 citations84
US10088244B2Oct 2, 2018
Adjustable heat sink fin spacing
IBM3 citations84
US9735083B1Aug 15, 2017
Adjustable heat sink fin spacing
IBM7 citations84
US9721870B2Aug 1, 2017
Cooling structure for electronic boards
IBM5 citations84
US9366591B2Jun 14, 2016
Determining magnitude of compressive loading
IBM10 citations84
US7913379B2Mar 29, 2011
Tool assembly for extracting and installing dual in-line memory module cardlets
IBM14 citations82
US6281692B1Aug 28, 2001
Interposer for maintaining temporary contact between a substrate and a test bed
IBM15 citations82
US11035625B2Jun 15, 2021
Adjustable heat sink fin spacing
IBM0 citations62
US10948247B2Mar 16, 2021
Adjustable heat sink fin spacing
IBM0 citations62
US10905029B2Jan 26, 2021
Cooling structure for electronic boards
IBM0 citations62
US11825592B2Nov 21, 2023
Electronic device console with natural draft cooling
IBM0 citations61
US10584924B2Mar 10, 2020
Adjustable heat sink fin spacing
IBM0 citations52
US10542636B2Jan 21, 2020
Cooling structure for electronic boards
IBM0 citations52
US9921008B2Mar 20, 2018
Adjustable heat sink fin spacing
IBM0 citations52
US10834808B2Nov 10, 2020
Electronic device console with natural draft cooling
IBM0 citations51
US6984997B2Jan 10, 2006
Method and system for testing multi-chip integrated circuit modules
IBM0 citations36
BODENWEBER PAUL F
4 patentsUS8717043B2May 6, 2014
Determining thermal interface material (TIM) thickness change
BODENWEBER PAUL F2 citations61
US9226426B2Dec 29, 2015
Electronic device console with natural draft cooling
BODENWEBER PAUL F2 citations60
US8794079B2Aug 5, 2014
Determining magnitude of compressive loading
BODENWEBER PAUL F3 citations60
US9105500B2Aug 11, 2015
Non-hermetic sealed multi-chip module package
BODENWEBER PAUL F0 citations51