Inventor
ZHENG JIANTAO
US14 patents
⚠️ This page may combine multiple inventors who share the name “ZHENG JIANTAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS7834442B2Nov 16, 2010
Electronic package method and structure with cure-melt hierarchy
IBM24 citations92
US7812438B2Oct 12, 2010
Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging
IBM21 citations92
US9366591B2Jun 14, 2016
Determining magnitude of compressive loading
IBM10 citations84
US7875972B2Jan 25, 2011
Semiconductor device assembly having a stress-relieving buffer layer
IBM10 citations84
US7733655B2Jun 8, 2010
Lid edge capping load
IBM11 citations81