Inventor
DOWNES JR FRANCIS J
US11 patents
Patents
11 patentsUS6373717B1Apr 16, 2002
Electronic package with high density interconnect layer
IBM97 citations97
US6829823B2Dec 14, 2004
Method of making a multi-layered interconnect structure
IBM31 citations92
US6720502B1Apr 13, 2004
Integrated circuit structure
IBM17 citations92
US6142361ANov 7, 2000
Chip C4 assembly improvement using magnetic force and adhesive
IBM19 citations92
US6626196B2Sep 30, 2003
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing
IBM23 citations91
US6176985B1Jan 23, 2001
Laminated electroplating rack and connection system for optimized plating
IBM29 citations91
US6887779B2May 3, 2005
Integrated circuit structure
IBM8 citations73
US6429384B1Aug 6, 2002
Chip C4 assembly improvement using magnetic force and adhesive
IBM9 citations73
US6693031B2Feb 17, 2004
Formation of a metallic interlocking structure
IBM7 citations72
US6348737B1Feb 19, 2002
Metallic interlocking structure
IBM8 citations72
US5230782AJul 27, 1993
Electrolytic process for reducing the organic content of an aqueous composition and apparatus therefore
IBM3 citations59