P

Inventor

TANG LAI GUAN

MY27 patents
⚠️ This page may combine multiple inventors who share the name “TANG LAI GUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

23 patents
US11036660B2Jun 15, 2021

Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices

INTEL CORP19 citations92
US10886218B2Jan 5, 2021

Fabric die to fabric die interconnect for modularized integrated circuit devices

INTEL CORP12 citations92
US11216397B2Jan 4, 2022

Translation circuitry for an interconnection in an active interposer of a semiconductor package

INTEL CORP6 citations86
US11670589B2Jun 6, 2023

Fabric die to fabric die interconnect for modularized integrated circuit devices

INTEL CORP4 citations84
US12334449B2Jun 17, 2025

Selective use of different advanced interface bus with electronic chips

INTEL CORP2 citations74
US11528029B2Dec 13, 2022

Apparatus to synchronize clocks of configurable integrated circuit dies through an interconnect bridge

INTEL CORP2 citations73
US11080449B2Aug 3, 2021

Modular periphery tile for integrated circuit device

INTEL CORP2 citations73
US10642946B2May 5, 2020

Modular periphery tile for integrated circuit device

INTEL CORP3 citations73
US11500412B2Nov 15, 2022

Techniques for clock signal transmission in integrated circuits and interposers

INTEL CORP2 citations72
US12009298B2Jun 11, 2024

Fabric die to fabric die interconnect for modularized integrated circuit devices

INTEL CORP2 citations71
US11726932B2Aug 15, 2023

Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices

INTEL CORP2 citations71
US12525980B2Jan 13, 2026

Systems and methods for dynamic power and thermal management for programmable logic devices

INTEL CORP0 citations62
US12153866B2Nov 26, 2024

Modular periphery tile for integrated circuit device

INTEL CORP0 citations62
US12026008B2Jul 2, 2024

Techniques for clock signal transmission in integrated circuits and interposers

INTEL CORP1 citations62
US11714941B2Aug 1, 2023

Modular periphery tile for integrated circuit device

INTEL CORP0 citations62
US11669472B2Jun 6, 2023

Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package

INTEL CORP0 citations62
US11621713B2Apr 4, 2023

High-speed core interconnect for multi-die programmable logic devices

INTEL CORP0 citations62
US11128301B2Sep 21, 2021

High-speed core interconnect for multi-die programmable logic devices

INTEL CORP0 citations62
US11062070B2Jul 13, 2021

Die to die interconnect structure for modularized integrated circuit devices

INTEL CORP0 citations62
US12394713B2Aug 19, 2025

Fabric die to fabric die interconnect for modularized integrated circuit devices

INTEL CORP0 citations61
US12425030B2Sep 23, 2025

Systems and methods for configurable interface circuits

INTEL CORP1 citations56
US10666261B2May 26, 2020

High-speed core interconnect for multi-die programmable logic devices

INTEL CORP0 citations52
US11336286B2May 17, 2022

Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies

INTEL CORP0 citations44

ALTERA CORP

3 patents

CHONG LAI KUAN

1 patent