Inventor
KIM HAK HWAN
KR25 patents
⚠️ This page may combine multiple inventors who share the name “KIM HAK HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
15 patentsUS9099631B2Aug 4, 2015
Semiconductor light-emitting device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD34 citations98
US9293675B2Mar 22, 2016
Semiconductor light-emitting device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD26 citations94
US8975655B2Mar 10, 2015
Semiconductor light-emitting device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations84
US6269251B1Jul 31, 2001
Method of calculating a code value for electric power control according to temperature compensation in wireless communication terminal
SAMSUNG ELECTRONICS CO LTD16 citations84
US10038127B2Jul 31, 2018
Semiconductor light-emitting device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9660163B2May 23, 2017
Semiconductor light-emitting device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US6477389B1Nov 5, 2002
Method for compensating for transmission power deviations of channels in a mobile phone
SAMSUNG ELECTRONICS CO LTD12 citations73
US9871172B2Jan 16, 2018
Semiconductor light emitting device package with wavelength conversion layer
SAMSUNG ELECTRONICS CO LTD3 citations70
US10361351B2Jul 23, 2019
Semiconductor light emitting element package including solder bump
SAMSUNG ELECTRONICS CO LTD3 citations69
US9391250B2Jul 12, 2016
Electronic device package and package substrate for the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US9153759B2Oct 6, 2015
Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD2 citations61
US8344399B2Jan 1, 2013
LED package with wide emission range and effective heat dissipation
SAMSUNG ELECTRONICS CO LTD0 citations51
US10147851B2Dec 4, 2018
Semiconductor light emitting device package
SAMSUNG ELECTRONICS CO LTD1 citations49
US9716214B2Jul 25, 2017
Light-emitting diode package
SAMSUNG ELECTRONICS CO LTD0 citations48
US9269620B2Feb 23, 2016
Method of manufacturing bump
SAMSUNG ELECTRONICS CO LTD0 citations46