Inventor
SONG JONG SUP
KR23 patents
⚠️ This page may combine multiple inventors who share the name “SONG JONG SUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
19 patentsUS9897266B2Feb 20, 2018
Light source module and lighting apparatus including the same
SAMSUNG ELECTRONICS CO LTD17 citations83
US11677059B2Jun 13, 2023
Light-emitting device package including a lead frame
SAMSUNG ELECTRONICS CO LTD2 citations71
US10892391B2Jan 12, 2021
Light-emitting device package including a lead frame
SAMSUNG ELECTRONICS CO LTD1 citations71
US10510936B2Dec 17, 2019
Light emitting device package including a lead frame
SAMSUNG ELECTRONICS CO LTD3 citations71
US10408430B2Sep 10, 2019
Asymmetric lighting lens, lighting lens array, and lighting apparatus therewith
SAMSUNG ELECTRONICS CO LTD3 citations71
US10084118B2Sep 25, 2018
Semiconductor light-emitting device
SAMSUNG ELECTRONICS CO LTD3 citations71
US11631791B2Apr 18, 2023
Semiconductor light-emitting device
SAMSUNG ELECTRONICS CO LTD0 citations61
US10964854B2Mar 30, 2021
Semiconductor light-emitting device
SAMSUNG ELECTRONICS CO LTD0 citations61
US10678036B2Jun 9, 2020
Optical device and light source module including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US9153759B2Oct 6, 2015
Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD2 citations61
US10971668B2Apr 6, 2021
Light-emitting device package including a lead frame
SAMSUNG ELECTRONICS CO LTD1 citations60
US9477032B2Oct 25, 2016
Substrates for packaging flip-chip light emitting device and flip-chip light emitting device package structures
SAMSUNG ELECTRONICS CO LTD1 citations52
US10777712B2Sep 15, 2020
Semiconductor light-emitting device
SAMSUNG ELECTRONICS CO LTD0 citations51
US10121934B2Nov 6, 2018
Method for manufacturing semiconductor light emitting device package
SAMSUNG ELECTRONICS CO LTD1 citations51
US9680074B2Jun 13, 2017
Optical device and light emitting device package including the same
SAMSUNG ELECTRONICS CO LTD1 citations47
US10014454B2Jul 3, 2018
Light-emitting device including chip-scale lens
SAMSUNG ELECTRONICS CO LTD0 citations43
US10205074B2Feb 12, 2019
Circuit board for mounting of semiconductor light emitting device and semiconductor light emitting device package using the same
SAMSUNG ELECTRONICS CO LTD0 citations41
US10699991B2Jun 30, 2020
Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same
SAMSUNG ELECTRONICS CO LTD0 citations37
US10644191B2May 5, 2020
Semiconductor package separating device
SAMSUNG ELECTRONICS CO LTD0 citations34