Inventor
NG CHUAN KIAK
MY3 patents
Patents
3 patentsUS7144538B2Dec 5, 2006
Method for making a direct chip attach device and structure
SEMICONDUCTOR COMPONENTS IND13 citations79
US7105378B2Sep 12, 2006
Method of forming a leadframe for a semiconductor package
SEMICONDUCTOR COMPONENTS IND9 citations68
US7247931B2Jul 24, 2007
Semiconductor package and leadframe therefor having angled corners
SEMICONDUCTOR COMPONENTS IND1 citations46