Inventor
LEE YEU WEN
MY5 patents
⚠️ This page may combine multiple inventors who share the name “LEE YEU WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND
4 patentsUS7755179B2Jul 13, 2010
Semiconductor package structure having enhanced thermal dissipation characteristics
SEMICONDUCTOR COMPONENTS IND8 citations80
US7144538B2Dec 5, 2006
Method for making a direct chip attach device and structure
SEMICONDUCTOR COMPONENTS IND13 citations79
US7105378B2Sep 12, 2006
Method of forming a leadframe for a semiconductor package
SEMICONDUCTOR COMPONENTS IND9 citations68
US7247931B2Jul 24, 2007
Semiconductor package and leadframe therefor having angled corners
SEMICONDUCTOR COMPONENTS IND1 citations46