Inventor
TEI SHINSUKE
JP18 patents
⚠️ This page may combine multiple inventors who share the name “TEI SHINSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKAWA KK
12 patentsUS7857190B2Dec 28, 2010
Wire bonding apparatus, record medium storing bonding control program, and bonding method
SHINKAWA KK67 citations97
US7934634B2May 3, 2011
Wire bonding method
SHINKAWA KK8 citations83
US7699209B2Apr 20, 2010
Wire bonding apparatus, record medium storing bonding control program, and bonding method
SHINKAWA KK17 citations83
US7686204B2Mar 30, 2010
Wire bonding apparatus, record medium storing bonding control program, and bonding method
SHINKAWA KK13 citations83
US7658314B2Feb 9, 2010
Tail wire cutting method and bonding apparatus
SHINKAWA KK9 citations82
US11450640B2Sep 20, 2022
Wire bonding apparatus and manufacturing method for semiconductor apparatus
SHINKAWA KK3 citations72
US7851347B2Dec 14, 2010
Wire bonding method and semiconductor device
SHINKAWA KK0 citations52
US12417997B2Sep 16, 2025
Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device
SHINKAWA KK0 citations51
US12374563B2Jul 29, 2025
Semiconductor device manufacturing method
SHINKAWA KK0 citations51
US12107067B2Oct 1, 2024
Wire bonding device, wire cutting method and non-transitory computer-readable recording medium recording program
SHINKAWA KK0 citations51
US12107070B2Oct 1, 2024
Wire bonding apparatus and method for manufacturing semiconductor device
SHINKAWA KK0 citations51
US12374653B2Jul 29, 2025
Manufacturing method of semiconductor device and wire bonding apparatus
SHINKAWA KK0 citations50