P

Inventor

HUANG JUNG-PANG

TW9 patents
⚠️ This page may combine multiple inventors who share the name “HUANG JUNG-PANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

6 patents
US10049955B2Aug 14, 2018

Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US9812340B2Nov 7, 2017

Method of fabricating semiconductor package having semiconductor element

SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US9324585B2Apr 26, 2016

Semiconductor package and method of fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US9117698B2Aug 25, 2015

Fabrication method of semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9899237B2Feb 20, 2018

Carrier, semiconductor package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US8895367B2Nov 25, 2014

Fabrication method of semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50

CHANG CHIANG-CHENG

1 patent
US8680692B2Mar 25, 2014

Carrier, semiconductor package and fabrication method thereof

CHANG CHIANG-CHENG5 citations81

HUANG JUNG-PANG

1 patent
US8519526B2Aug 27, 2013

Semiconductor package and fabrication method thereof

HUANG JUNG-PANG5 citations77

CHEN YAN-HENG

1 patent
US8829672B2Sep 9, 2014

Semiconductor package, package structure and fabrication method thereof

CHEN YAN-HENG1 citations45