Inventor
CHUANG KUAN-WEI
TW5 patents
⚠️ This page may combine multiple inventors who share the name “CHUANG KUAN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
4 patentsUS12354885B2Jul 8, 2025
Electronic package, electronic structure and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US8895367B2Nov 25, 2014
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US9548220B2Jan 17, 2017
Method of fabricating semiconductor package having an interposer structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9257381B2Feb 9, 2016
Semiconductor package, and interposer structure of the semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49