Inventor
JIANG YIH-JENN
TW11 patents
⚠️ This page may combine multiple inventors who share the name “JIANG YIH-JENN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
10 patentsUS7638879B2Dec 29, 2009
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD26 citations92
US11764188B2Sep 19, 2023
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations84
US12255182B2Mar 18, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations62
US7993967B2Aug 9, 2011
Semiconductor package fabrication method
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations62
US8895367B2Nov 25, 2014
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US12159821B2Dec 3, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47
US12575420B2Mar 10, 2026
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46
US10192838B2Jan 29, 2019
Fabrication method of packaging substrate
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46
US12414232B2Sep 9, 2025
Substrate structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations44
US11791300B2Oct 17, 2023
Electronic package and circuit structure thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations44