Inventor

AN SANG-HO

KR7 patents

⚠️ This page may combine multiple inventors who share the name “AN SANG-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

4 patents

US7368811B2May 6, 2008

KWAK DONG-OK

2 patents

US8791554B2Jul 29, 2014

Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates

KWAK DONG-OK8 citations80

US8838885B2Sep 16, 2014

Solid state drive packages and related methods and systems

KWAK DONG-OK11 citations79

CHUN SUNG-HOON

1 patent

US9496216B2Nov 15, 2016

Semiconductor package including stacked semiconductor chips and a redistribution layer

CHUN SUNG-HOON20 citations78

AN SANG-HO

SAMSUNG ELECTRONICS CO LTD

Multi-chip package and method for manufacturing the same

Multi-chip module having bonding wires and method of fabricating the same

Method and apparatus for bonding a wire

Semiconductor package

KWAK DONG-OK

Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates

Solid state drive packages and related methods and systems

CHUN SUNG-HOON

Semiconductor package including stacked semiconductor chips and a redistribution layer